UltraFusion

E202476

UltraFusion is Apple’s custom high-bandwidth die-to-die interconnect technology that links two M1 Max chips into a single M1 Ultra system-on-a-chip.

All labels observed (1)

Label Occurrences
UltraFusion canonical 3

How this entity was disambiguated

Statements (29)

Predicate Object
instanceOf Apple silicon technology ⓘ
die-to-die interconnect technology ⓘ
announcedBy Apple Inc. ⓘ
announcedWith Apple M1 Ultra ⓘ
announcementEvent Apple March 2022 event ⓘ
bandwidth 2.5 TB/s ⓘ
connects M1 Max ⓘ
linked to: Apple M1 Max

two M1 Max dies ⓘ
designGoal to avoid NUMA-like complexity for software ⓘ
to provide very high inter-die bandwidth ⓘ
developer Apple Inc. ⓘ
enables software to see two M1 Max dies as a single SoC ⓘ
unified memory architecture across two M1 Max dies ⓘ
generation first generation Apple UltraFusion interconnect ⓘ
interconnectType high-bandwidth die-to-die interconnect ⓘ
marketedAs UltraFusion ⓘ
partOf Apple silicon platform ⓘ
purpose to link two M1 Max chips into a single system-on-a-chip ⓘ
relatedTo advanced packaging technologies ⓘ
chiplet-based SoC design ⓘ
supports low-latency communication between dies ⓘ
technologyDomain semiconductor interconnects ⓘ
system-on-a-chip design ⓘ
usedFor scaling CPU performance ⓘ
scaling GPU performance ⓘ
scaling memory bandwidth ⓘ
usedIn Apple M1 Ultra ⓘ
usedInProductLine Mac Studio ⓘ
usedWith Apple M1 Max ⓘ

How these facts were elicited

Referenced by (3)

Full triples — surface form annotated when it differs from this entity's canonical label.

UltraFusion → marketedAs → UltraFusion ⓘ