Intel Lakefield platform

E648228

Intel Lakefield is a hybrid CPU platform that combines high-performance and low-power cores in a 3D-stacked package to enable ultra-mobile, energy-efficient devices.

All labels observed (1)

Label Occurrences
Intel Lakefield platform canonical 1

How this entity was disambiguated

Statements (49)

Predicate Object
instanceOf hybrid CPU architecture ⓘ
microprocessor platform ⓘ
announcementDate 2019 ⓘ
architectureFamily Intel Core ⓘ
bigCoreType Sunny Cove ⓘ
coreConfiguration 1 big core + 4 small cores ⓘ
coreCount 5 ⓘ
cpuArchitecture Intel Sunny Cove ⓘ
Intel Tremont ⓘ
x86-64 ⓘ
designGoal energy efficiency ⓘ
long battery life ⓘ
ultra-mobile devices ⓘ
developer Intel ⓘ
linked to: Intel Corporation
discontinuationDate 2021 ⓘ
exampleSKU Intel Core i3-L13G4 ⓘ
linked to: Intel Core i3

Intel Core i5-L16G7 ⓘ
hybridDesign big.LITTLE-like ⓘ
integrates CPU cores ⓘ
GPU ⓘ
I/O controllers ⓘ
LPDDR4X memory ⓘ
launchDate 2020 ⓘ
manufacturer Intel ⓘ
linked to: Intel Corporation
memoryPlacement package-on-package ⓘ
memoryType LPDDR4X ⓘ
notableDesignFeature heterogeneous core cluster ⓘ
stacked logic and memory dies ⓘ
packageType 3D-stacked package ⓘ
packagingTechnology Foveros 3D stacking ⓘ
powerTarget low TDP ⓘ
precedes Intel Alder Lake hybrid architecture ⓘ
linked to: Alder Lake-N
processTechnology 10 nm ⓘ
productLine Intel Core i3-L series ⓘ
linked to: Intel Core i3

Intel Core i5-L series ⓘ
linked to: Intel Core i5
smallCoreType Tremont ⓘ
status discontinued ⓘ
succeeds Intel ultra-low-power Core Y-series ⓘ
supports 64-bit computing ⓘ
Intel Deep Learning Boost ⓘ
Intel Speed Shift ⓘ
Intel Turbo Boost ⓘ
Intel UHD Graphics ⓘ
hardware virtualization ⓘ
targetDeviceCategory dual-screen laptops ⓘ
foldable PCs ⓘ
ultra-thin notebooks ⓘ
useCase always-connected PCs ⓘ
thin-and-light laptops ⓘ

How these facts were elicited

Referenced by (1)

Full triples — surface form annotated when it differs from this entity's canonical label.

Tremont → introducedBy → Intel Lakefield platform ⓘ